First, the board frame must be drawn on the Keep-Out Layer layer, and then go to the top menu bar of the software → Design → Rules, and then create a constraint rule with priority above Clearance in Clearance under Electrical. The figure is Clearance_Board. The settings are edited according to the figure below. The distance between the specific copper clad and the board frame can be adjusted at 20mil (about 0.5mm) below. After the setting is complete, T+G selects Shelve x Polygon(s) (the function is equivalent to P+O of PADS). Click T+G again and select Restore x Shelved Polygon(s) to see the effect.
Altium Designer 13 Design Memo 1-How to set the distance between the copper pour and the board frame
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Origin blog.csdn.net/ps574134526/article/details/89312209
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