Introduction to RK3588 AI Edge Computing Motherboard Specifications
About this document
This document introduces in detail the shape, size, and technical specifications of the AI edge computing motherboard based on the Rockchip RK3588 chip, as well as detailed hardware interface design reference instructions, so that customers can quickly apply the RK3588 edge computing motherboard to industrial Internet, smart cities, smart security, Smart terminal equipment in the field of artificial intelligence such as smart transportation and smart medical care.
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- product description
This product is an AI edge computing motherboard based on Rockchip RK3588 architecture. RK3588 is a new generation of domestic flagship high-performance 64-bit octa-core processor. It adopts 8nm technology and has high computing power, low power consumption, super multimedia, and rich data interfaces. Features. Equipped with quad-core A76+ quad-core A55 octa-core CPU and ARM G610MP4 GPU , built-in NPU with 6 TOPs computing power . Support 8K@60fps video decoding , support 8K30fps encoder, the peripheral interface is very rich, with super scalability. RK3588 built-in embedded neural network processor
(NPU), the NPU computing power can reach 6.0TOPs, support PCI-e/USB3.0/RGMIIMP, and can perform video structural recognition and analysis on 32-channel 1080P network cameras.
The edge computing motherboard of the Rockchip RK3588 chip has powerful computing power, rich input and output interfaces and strong scalability. The PCB is designed with 10-layer immersion gold technology, which has excellent electrical characteristics and anti-interference characteristics, stable and reliable operation, and can reach industrial-grade standards. It can be widely used in artificial intelligence terminal fields such as smart cities, smart security, smart medical care, and industrial Internet.
Chip Block Diagram-
- platform features
- Rockchip RK3588 adopts 8nm LP technology, based on quad-core Cortex-A76, quad-core Cortex-A55 large and small core CPU structure 64bit ultra-high-performance processor, the main frequency is up to 2.4GHz, and the powerful RK3588 can be used in various AI application scenarios Bringing extremely excellent performance, compared with RK3399, the CPU performance has been improved by 3 times;
- The built-in NPU computing power can reach up to 6.0 TOPs, three-core structure, flexible distribution of computing power. High computing power NPU can support INT4/INT8/INT16/FP16 mixed computing, and its strong compatibility can easily convert network models based on a series of frameworks such as TensorFlow / MXNet / PyTorch / Caffe ;
- Support 32 channels of 1080P decoding, built-in a variety of powerful embedded hardware engines, support 8K @ 60fps H.265 and VP9 decoders, 8K @ 30fps H.264 decoders and 4K @ 60fps AV1 decoders; support 8K30fps H.264 and H.265 encoders, high-quality JPEG encoder / decoder, dedicated image pre-processor and post-processor, compared with RK3399 , GPU performance has increased by 6 times;
- Built-in 3D GPU , compatible with OpenGL ES1.1/2.0/3.2 , OpenCL 2.2 and Vulkan1.2 . Special with MMU
- platform features
The 2D hardware engine will maximize display performance and provide a smooth operating experience;
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- Built-in Rockchip self-developed 48M pixel ISP ( image signal processor ) , supports the realization of many algorithm accelerators, such as HDR ,
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3A , LSC , 3DNR , 2DNR , sharpening, defogging, fisheye correction, gamma correction, etc.;
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- Support up to 32G super large running memory, faster response, more real-time, with high-performance 4- channel external memory interface
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( LPDDR4/LPDDR4X/LPDDR5 ), able to support demanding memory bandwidth;
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- It has HDMI 2.1/MIPI-DSI/DP1.4/VGA multiple video output and HDMI RX2.0/MIPI-CSI video input interface , supports multiple 8K video output and 4K video input, and can realize up to four screens with different displays;
- 4- way standard SATA3.0 interface, which can expand multiple 2.5/3.5 -inch SSD/HDD hard disks at the same time; onboard high-speed M.2 SA- TA3.0 interface, supports M.2 2242 high-speed solid-state hard disk; allows equipment to be easily expanded Large capacity up to TB level;
- Onboard standard PCIe3.0 ( 4 Lane ) interface, the data transmission rate of each Lane reaches 8Gbps , and the transmission rate of 4 Lanes can reach up to 32Gbps , high-speed and stable transmission, which can be used to expand standard PCIe3.0 devices;
- With RS485 , RS232 , I2S , I2C , UART , CAN , SPDIF , MIPI CSI , MIPI DSI , USB3.0 , USB2.0 , SPI , GPIO and other expansion interfaces, it can cover edge computing, smart medical care, industrial control and other smart terminals interface requirements ;
- The operating temperature range can reach -20°C ~ +70°C, and there is an optional version of the car-grade RK3588 chip from -40°C ~ +85°C;
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RK3588 AI BOX Appearance
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- motherboard picture
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- Motherboard Block Diagram
Motherboard size: 146*102mm
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- motherboard interface
RK3588 edge computing motherboard interface description |
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Function |
interface description |
Internet function |
Support single frequency (2.4GHz)/dual frequency (2.4GHz/5GHz) WIFI, AMPAK, Bilian and other brands are optional |
Support Quectel and other mainstream 5G/4G modules |
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Support RJ45 dual Gigabit Ethernet ports |
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motherboard interface |
Support eDP, MIPI, DP display interface, support touch screen TP interface; |
Support binocular MIPI-CSI camera interface, support MIPI DSI camera input |
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Support one Headphone, one MIC, one Speaker and one LINE-IN interface |
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USB3.0*1,USB2.0*1,Type-C*1 |
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TF card*1 |
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DI*2, DO (Relay relay)*2 |
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RS485*1,RS232*1 |
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CAN*1 |
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HDMI IN*1,HDMI OUT*2 |
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5G/4G MINI-PCIE interface*1 |
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5G/4G SIM card*1 |
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SATA port*1 |
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M.2 port*1 |
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RTC battery*1 |
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POWER button*1, RESET button*1, RECOVERY button*1 |
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LED Status Indicator*4 |
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Debug Debug serial port*1 |
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DC IN*2 (DC socket + Phoenix terminal, 12V~65V) |
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- Application field
- edge computing
- digital cockpit
- Smart Security
- Smart transportation
- Smart medical
- Application field
and other edge computing and artificial intelligence product terminals.
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- Design and Production Advice
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- reference circuit
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Since the reference design is updated irregularly, please obtain relevant reference design materials through formal channels.
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- Backplane layout design
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It is necessary to carry out corresponding anti-ESD design for each peripheral interface;
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- Thermal treatment
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Since the multi-core high-performance processor generates a lot of heat when it is running at full load, please consider system-level heat dissipation when actually using the product.
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- Transportation and Production
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Since the modules are matched with different bottom plate characteristics, the specific furnace temperature setting during the production of the paste varies from product to product, please evaluate in detail during production;
Since the motherboard may have experienced different time and environment during the process from the production of the motherboard to the assembly of the finished product, it is necessary to do a good job of dehumidification and drying of the motherboard before attaching the parts;
Since the main board is exposed in all directions and is an electrostatic sensitive device, anti-ESD measures should be in place during the process of picking and moving;
Smart community: Collaborate with security inspection, fire protection, and social environment to ensure the quality of life in the community
Let the light poles have AI algorithms to protect the life and operation of the community around the clock
Smart logistics: All-round inspection of package quality and environment, reducing labor management costs
Refined management of logistics warehouses to fully guarantee the safety of goods
Smart manufacturing: Improve industrial testing capabilities to ensure production safety and quality
Meet a variety of testing needs and reduce the cost of manual quality inspection