https://news.cnblogs.com/n/653710/
Today, China announced that Canon, Japan's first semiconductor lithography machines on sale the 50th anniversary of PPC-1 Canon production . Canon PPC-1 in 1970 on sale, with the rapid development of digital technology, Canon's semiconductor lithography machines are constantly upgraded.
Taiwan and Japan first semiconductor lithography PPC-1
It is learned that history begins with a high degree of Canon lithography applications for the camera lens technology . Flexible use of the mid-1960s technology accumulated in the development of the camera lens, Canon developed a high-resolution lens for photomask manufacturing.
Thereafter, in order to further expand the business scope, Canon began research and development of semiconductor lithography machines, and in 1970 Japan's first successful sale of semiconductor lithography machines PPC-1, officially entered the field of semiconductor lithography machines.
Canon in 1975, the sale of the FPA-141F lithography machine in the world for the first time by 1 micron (00 millionths of a meter) below the exposure , this technology as an "important historical information science and technology (future technology heritage)", in 2010 was included in the Japanese National Science Museum of industrial technology information Center of historical data.
Canon's current lineup includes i-line lithography lithography and KrF lithography machine product line . Wherein, i-ray lithography refers to lithography using a semiconductor i-line (wavelength mercury lamp 365nm) light source. And KrF lithography machine is the use of wavelength 248nm, the semiconductor laser lithography by krypton (Kr) gas and fluorine gas generation (F).
Canon said it will continue to expand the product lineup and optional features of semiconductor lithography machines, to support a variety of wafer sizes and materials as well as next-generation packaging technology.
Further, in the field of the tip to meet further miniaturization of a circuit pattern needs, Canon are committed to promoting the development of semiconductor manufacturing equipment for nanoimprinting of ※ 7, and it can be applied to large scale production.
What is a semiconductor lithography machines?
The semiconductor lithography machine in a manufacturing process of a semiconductor device, assume the role of "Exposure". The semiconductor device is formed by exposing fine circuit patterns on a semiconductor substrate called a wafer made of. Effect semiconductor lithography apparatus is drawn on the mask circuit pattern is reduced by the projection lens, then the exposure pattern on the wafer.
Sequentially moving the wafer in the wafer stage, the repeated circuit pattern exposed on a wafer. Because the circuit is the result of a hyperfine pattern from nanoscale to micron multilayer stack formed, the semiconductor lithography machines also need to have high precision techniques to meet the performance units from micrometer to nanometer level.
The following is a semiconductor device manufacturing process :
1, the production mask (original)
Design decision circuit chip function and performance of semiconductors. A circuit pattern drawn on dozens of glass sheets.
2, wafer preparation
The semiconductor device prepared based disk-shaped wafers. Forming an oxide film on the surface after heating, and then coated with a photoresist (photosensitive agent).
3, a circuit pattern drawn on the wafer
① illumination on the mask, exposing the circuit pattern on the wafer. Reduction through the lens, finer line can be drawn. The finer circuit line width, the greater the number of semiconductor elements can be integrated on a semiconductor device, which can obtain a high-performance and multi-functional semiconductor device. (Using lithography)
Exposure schematic
Light to the rear portion of the resist changes. The exposed portion is removed using a developing solution.
Film is formed by oxidizing the gas ② resist other than the portion covering the reaction is removed.
③ After removing unnecessary photoresist on a bare wafer by implanting ions of the transistors work effectively, thereby manufacturing a semiconductor device.
④ After the entire wafer covered with an insulating film, the surface is leveled to ensure that no irregularities. Then coated with photoresist to be exposed next layer of circuit pattern.
① ~ ④ the process is repeated, a plurality of layers formed on the wafer surface, and connected by wiring.
4, are cut from the wafer of semiconductor chips
5, the chip is adhered to the frame, the wire connected to the semiconductor device to inspect finished
