Industrial circular connectors low pressure injection molding process to improve the water level waterproof

Low-pressure injection molding process is to produce a low pressure injection into a mold and rapidly solidified hot melt adhesive material forming the packaging process (1-50 seconds), the hot melt adhesive material to excellent sealing and excellent physical and chemical properties reaches insulation, temperature, shock, vibration, moisture, water, dust, chemical corrosion and other effects. Play a good role in the protection of electronic components. Compared with the traditional casting process of (e.g., two-component epoxy / polyurethane potting), low pressure injection molding process is not only environmentally friendly, but significantly improve production efficiency can help to reduce overall production costs.
Industrial circular connectors low pressure injection molding process to improve the water level waterproofIndustrial circular connectors low pressure injection molding process to improve the water level waterproof

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