Extra episode 12: ADS is exported to AD to become a PCB file and Jiali creates the board
Extra Story 12: ADS is exported to AD to become a PCB file, the example here is a power amplifier!
STEP 1: Export dxf file from ADS
Open the prepared layout file, and make cooling holes and fixing holes on the original basis. The radius of the cooling hole is 0.635mm, and the fixing hole is half 1mm. Select File and click Export: Select the DXF/DWG type file on the pop-up window and export it
: 
Open The file we saved just now may be prompted to open as a read-only file. Here we just observe that it is correct, and we can see that the exported file is correct:
STEP 2: Import dxf file from AD
Create a new PCB file:
select File in the menu bar, import in it, DXF/DWG file:
select the dxf file to be imported to AD:
click OK, and the following selection interface will pop up. The selection here requires great attention. If the unit in ADS is mil, then the unit of the exported dxf file is also mil, so the unit of the ratio here is also selected as mil. Choose to import as elements, with borders and holes as keep out layers, and everything else as the top layer. There is no need to get too entangled here, and you can correct it if you make a mistake.
After the setting is complete, click OK to import it into AD, but only the lines are imported, and there may be some incompatibility, as shown below:
adjust the border number of the original circuit part to be consistent with that in ADS (long press And move the mouse to drag, long press to drag and press space to select, long press to drag and press X or Y to mirror and flip), the corrected picture obtained is as follows, the picture is all red lines, but Because the online DRC is turned on, there is a rule conflict, so it is green:
the following is a slight correction to this board, including that the microstrip lines on the left and right sides should be slightly shorter, so as not to touch the keepout-layer (or increase the width of the board) ), delete the mid-level useless parts (mainly the punching of the transistor will not be reflected on the PCB), and the modification is as follows:
STEP 3: Fill the main circuit
The following filling of the board is to fill the Top layer between the lines. First select the closed image to be filled:
Select Tool->convert->Create Region From selected…. Click OK to complete the filling (press the shortcut key TVE in sequence):
follow this step to fill all the graphics of the circuit part (excluding the copper pour part):
the copper pour of the main circuit part has been basically completed here , delete the red line on the edge of the copper skin (green because of the rule conflict), and the deletion is as follows (you can see that the edge of the microstrip line is not green):
STEP 4: Set the size of the board and the processing of the hole digging part
First select the outermost boundary:
shortcut key (press DSD in sequence) to set the board shape:
select the part to be dug in the middle level, change this part of the board layer into a Keepout layer, and press the shortcut key (press TVB in sequence) to dig Hole:
Select the circular cooling hole to be dug and the positioning hole, and use the same method to dig the hole, thus completing the steps of digging the hole:
STEP 5: Copper pouring of thermal vias and backplane
Shortcut key D->N->N to open Netlist management, add a new network name as GND, click OK: the
next step is to pour copper, first is the front. Insert a small copper skin and set its network to GND:
Select the copper pour button on the shortcut toolbar to pour copper:
there are three pieces on the front side, which need to be selected and poured copper separately, but the area has been set at this time, and the copper pour has not yet started :
After the area setting is completed, delete the red lines that mark the copper pour position imported at the beginning (because the rule error is actually green), after deletion, it is as follows: set the three front copper pour
areas to link to the GND network, The type of copper pour is solid (also set the two parameters of copper pour to 0.5 and 0):
select Rules in Design, set Clearance to 3mil (in order to make copper pour in all positions except holes):
after setting, select a pour Right-click on the copper area, select Repour all under polygon actions, and the copper pour on the front side is as follows:
A small copper skin connected to GND is also inserted on the back side:
copper pouring is also performed on the back side:
the copper pouring is completed.
STEP 6: Remove green oil
For power amplifiers, green oil is generally not used, and the copper skins are exposed between them. However, the front and back are covered with green oil at this time:
how to remove the copper skin? Insert a Top Solder of the same size as the board on the front, and a Bottom Solder of the same size as the board on the back:
Take a look at the final effect:
STEP 7: Jiali creates an order
The high-frequency board is used here, Rogers4350B, and Jiali Chuang supports placing an order:
click to place an order now, and choose the board 4350B:
the price is only 600 yuan, which is very cheap:
STEP 8: physical assembly
Radiator design reference: ## Fanwai 8: ADS exports DWG files and submits them to the factory for board manufacturing (power amplifier board and radiator)
The final object looks like this:
