When we buy electronic products, such as mobile phones, televisions or computers, there is an important component inside each of these devices, and that is a semiconductor chip. Semiconductor chips are made up of many tiny electronic components, and in order to protect and use these chips, they need to go through a process called packaging. The following is an easy-to-understand process flow for semiconductor chip packaging:
- Chip manufacturing: First, chip manufacturers will manufacture chips on silicon wafers through a series of process steps. This process includes steps such as depositing materials, etching patterns, and doping materials on silicon wafers, and finally forms many tiny electronic components.
- Dicing: During the chip manufacturing process, many chips are fabricated on a single silicon wafer. Before packaging, this silicon wafer needs to be diced into individual chips. This is usually done using cutting tools and techniques.
- Soldering: There are many metal pins on the chip, which are used to connect the chip and other electronic devices. During the packaging process, these pins need to be connected to external wires or pads. This step usually uses a soldering technique, such as solder or solder balls, to ensure that the pins are well connected to the outside.
- Encapsulation: In order to protect the chip and provide proper physical support, the chip needs to be placed in an enclosure. This housing is usually made of plastic or ceramic material. The chip is placed precisely inside the housing and secured using glue or other adhesives.
- Wire connections: Inside the case, the chip's pins need to be connected to external circuits. This step usually involves connecting the chip's pins to external metal wires. These wires can be gold, copper, or other conductive material to ensure a good connection for signal transmission.
- Package sealing: In order to protect the chip from environmental factors, the packaging process seals the case. This typically uses resin or glue to fill the enclosure and keep the inside of the chip free from dust, moisture or other contaminants.
- Functional testing and quality control: After packaging is complete, the chip needs to be functionally tested to verify that it is working properly.
In terms of packaging, there are different types of chips corresponding to different pin positions. Yufanwei helps customers customize packaging, such as sot23-8, sot23-10, sot23-16, ssop16, etc., and has corresponding patents.
Why does packaging need to be customized?
In order to prevent plagiarism and save costs, some chips can seal multiple chips together, which reduces the PCB area. This is the case with the package customization technology provided by Yufan Micro.
The above is the semiconductor chip packaging process, please ask me if you don’t understand~