Huawei announced a flip-chip packaging technology that can greatly improve CPU heat dissipation - Code World

Huawei announced a flip-chip packaging technology that can greatly improve CPU heat dissipation

News 2023-08-26 04:51:22 views: null

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Origin blog.csdn.net/yfw88888/article/details/132357710

Huawei announced a flip-chip packaging technology that can greatly improve CPU heat dissipation

Huawei discloses the innovative technology of "flip-chip packaging" to improve heat dissipation performance, and the fire dragon turns into an ice dragon in seconds

Huawei a annoncé une technologie de packaging flip-chip qui peut grandement améliorer la dissipation thermique du processeur

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