Samsung Electronics announced on September 27 that it will launch its first 7.5 Gbps low-power compressed add-on memory module (LPCAMM) in 2024. This module combines the advantages of compactness, detachability and high-speed transmission and will be extremely competitive in the market. force.
After the news was released, foreign media anantech obtained detailed information about LPCAMM memory. LPCAMM memory is an improved CAMM specification interface for LPDDR memory, but the LPCAMM form factor is not compatible with CAMM, both physically and electrically. Samsung can use 128-bit memory bus on a single memory module by placing 4x32 LPDDR5X memory particle packages directly on the compression connector through LPCAMM.
The contacts of LPCAMM memory are located on the back of the PCB board, corresponding to the positions of the four LPDDR5X memory chips. The distance between memory particles and contacts is very small, which can minimize the distance of signal transmission between the memory controller and the memory chip. The LPCAMM memory size is 78 mm x 23 mm. In addition to the DRAM package itself, the SPD and power management IC (PMIC) are included below the LPCAMM module. The LPCAMM standard allows modules to provide their own voltage regulation and identification.
Samsung plans to launch 32GB, 64GB and 128GB versions of the first-generation LPCAMM memory with data rates up to LPDDR5X-7500. However, since Samsung currently does not have 256 Gbit LPDDR5X memory chips, in order to achieve a single 128GB memory, it must either install 8 chips on LPCAMM or increase the overall memory size.
Compared with So-DIMM, LPCAMM can occupy up to 60% less space on the motherboard. This not only makes more efficient use of the internal space of the device, but also increases performance and energy efficiency by 50% and 70% respectively.
The results of this research and development have completed system verification on the Intel platform. LPCAMM will be applied to next-generation systems for testing with major customers this year, and it is planned to achieve commercialization in 2024.
As for standardization, according to Samsung, they are working with partners to develop the JEDEC standard for LPCAMM. JEDEC announced in March that they were committed to extending the CAMM standard to cover LPDDR memory and using the same connector for DDR5 and LPDDR5, but no follow-up news has been announced yet.