- Arcing 电弧放电
- PR burn 光阻烧焦
- Peeling 掀起
- Bubble 泡泡
- Pits 凹洞
- Broken 破片
- Polymer 聚合物
- Blind VIA 介层瞎窗
- Poor planization 平坦化不良
- Blister 发泡 ( 亮点突起 )
- PR Shrink 光阻内缩
- Foreign contamination 外来脏污
- Poor Coating 光阻涂布不良
- Corrosion 腐蚀
- PR Flow 光阻流动
- Craze 缺角
- PR Lifting 光阻剥离
- Crack 龟裂
- PR Non-uniform 光阻厚度不均匀
- Tape residue 残胶
- PR remaining 光阻残留
- Si fragment 碎晶片
- Powder 粉末
- Contamination 脏污
- PR Bridge 光阻桥接
- Dis-color 颜色异常
- Residure ( ETCH) 蚀刻残留
- Damaged 损伤
- Residue( PHOTO ) 黄光光阻残留
- Educt of Phosphorous 磷析出
- Residue( unknow ) 无法定义之残留
- Film abnorment 薄膜异常
- Repeating Defect 重复性缺陷
- Finger print 手指印
- Roughness 粗糙
- Flow type particle 扬起状尘埃
- Residue( SPUT ) 金属溅镀残留
- Metal flaking 金属剥落
- Scratch 刮伤
- Hillock 凸起
- Si nodule 硅斑
- Nitride haze 氮化硅表面雾状
- Slip 滑移线
- Local Defocus 区域聚焦不良
- Shot Defocus Shot聚焦不良
- Mis-alignment 对准不良
- Stacking Faults 叠差
- Missing pattern 定义不良
- Spike 亮点,凸起物
- Notching 老鼠咬 ( 锯齿状 )
- Non-uniform 颜色 / 线不均匀
- Tree - Like Defect 树枝状腐蚀
- No Pattern 没有图形
- Thickness abnormal 厚度异常
- Orange Peel 橘子表面
- Under develop 显影不良
- Over-etch 蚀刻过度
- Void 孔洞
- Out of control 超出控制
- W Precipitation 钨折出
- Out of spec 超出规格
- Particle 尘埃
- Water spot 水痕
From 知乎：黑暗森林-张斌